Official box and my experience with it

Banana Pi Router design BPI-R4(MT7988)
21

You should know that they built this case as part of a heat-sinking system. Thermal transfer happens on the contact part (the thermal pad between the wireless module and the shield). If you drill holes in the bottom plate, then it would only reduce the area that could directly contact the shell - which reduces the efficiency of heat dissipation. What I suggest would just remove the contact part of the shield, and directly apply an active/passive heat sink on it.

22

For everyone who hasn’t gone this far, I suggest purchasing some tiny heatsinks from Amazon (Like those: https://www.amazon.ca/Awxlumv-Heatsink-25-x25-x10/dp/B08CMK8BMT) and directly pasting under the bottom, that will increase the area of heat transfer if you are afraid of getting overheat.

23

Good afternoon, I bought these and had to remove them from the box, they did not fit. I do not know what size the ones you have included are, but they should be very small.

condensadore
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Here are the measurements 13x12x3mm

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Here is another photo

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I think mine were smaller and when you close the box they don’t fit.

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This is the heatsink that you buy on Aliexpress

https://es.aliexpress.com/item/1005004248744480.html?spm=a2g0o.order_list.order_list_main.647.21ef194dSlId1O&gatewayAdapt=glo2esp

25

Tape isn’t going to solve this, you literally ruined this case by removing almost half the thermal mass from the bottom board. Tape/plastic doesn’t conduct heat nearly as well as metal (I would assume aluminum in this case) does, the case is designed to be a heatsink, the bottom part/plate is essential to cool the BE14 card chips and you pretty much ruined its thermal conductivity. You need to replace the whole bottom plate or buy a new case entirely.

26

This is wrong, you shouldn’t put heatsink on top of the BE14 unless you are running the whole setup caseless.

The BE14 chips need to be fitted with thick thermal pads that will come directly into contact with the bottom of the case (assuming it’s intact).

In fact I don’t think the heatsinks in your picture are enough to cool the BE14 chips while running caseless, you would need them in tandem with active cooling.

27

Good morning @Mathieulh, thanks for your advice, because what I have done again has been to remove the cardboard and the tape, and that my refrigeration keeps them cold, don’t worry, if the bed14000 burns, it will be my responsibility.

Thanks for your wise advice,

Regards

28

Speaking of thermal pads for the BE14 chips, is there any official info on pad thickness? I tried to measure the gap between the chips and the bottom plate of the chassis with a feeler gauge, but other components were getting in the way.

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29

Here he talks about the thermal pads used in the BE14 WiFi 7 module:

Thermal pad comparison to know which one to buy:

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