Official box and my experience with it

Banana Pi Router design BPI-R4(MT7988)
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I guess similar to mine

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I know the forum isn’t good at showing what I replied too, seeing that you and @SpectreDev both answered the same in regard to the original post. But I was replying to the post that had this image https://forum.banana-pi.org/uploads/default/original/2X/e/e18c24373fce518db72c0791116425147913e79d.jpeg in it.

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Ah,sorry…looks like an external rtc due to the cell battery

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Ah, I think that’s the RTC battery

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Yes, that is a battery “case” for the RTC clock which is already part of the board. Got this from amazon in a 10x package where about 60% worked…

The one I got is this https://www.amazon.co.uk/gp/product/B09WVL8XNB, but I want to belive that there are better options.

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Now I can rest easy, the box is cool.

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This is especially dumb, you are literally drilling thermal mass out of the case, the case is a heatsink, the less materials it has, the less efficiently it’ll cool the board. Drilling the bottom part is even worse as this part comes into direct contact of the BE14000 ICs thermal pads.

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This is some really bad work, should’ve just replace the top with a mesh at most

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Good morning @Mathieulh, thanks for the notice, we will cover the bottom where the be14.000 is located to protect it and prevent direct air from hitting it.

Also, on the top part, vents have been made so that the air can escape, as long as it looks aesthetically I don’t care, what I didn’t want was to burn any component of the board or the be14000 module, my box really burned.

I don’t know if this will be enough, but at least it won’t be the toaster I had before, it burned the box.

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Good afternoon @Mathieulh, I have finally put this covering the air that entered the be14000 module, it covers it exactly, I hope it is enough, for the rest it remains as follows.

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Thanks for the information

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whats the point of putting the holes and then covering it with tape

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You should know that they built this case as part of a heat-sinking system. Thermal transfer happens on the contact part (the thermal pad between the wireless module and the shield). If you drill holes in the bottom plate, then it would only reduce the area that could directly contact the shell - which reduces the efficiency of heat dissipation. What I suggest would just remove the contact part of the shield, and directly apply an active/passive heat sink on it.

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For everyone who hasn’t gone this far, I suggest purchasing some tiny heatsinks from Amazon (Like those: https://www.amazon.ca/Awxlumv-Heatsink-25-x25-x10/dp/B08CMK8BMT) and directly pasting under the bottom, that will increase the area of heat transfer if you are afraid of getting overheat.

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Good afternoon, I bought these and had to remove them from the box, they did not fit. I do not know what size the ones you have included are, but they should be very small.

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Here are the measurements 13x12x3mm

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Here is another photo

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I think mine were smaller and when you close the box they don’t fit.

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This is the heatsink that you buy on Aliexpress

https://es.aliexpress.com/item/1005004248744480.html?spm=a2g0o.order_list.order_list_main.647.21ef194dSlId1O&gatewayAdapt=glo2esp

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Tape isn’t going to solve this, you literally ruined this case by removing almost half the thermal mass from the bottom board. Tape/plastic doesn’t conduct heat nearly as well as metal (I would assume aluminum in this case) does, the case is designed to be a heatsink, the bottom part/plate is essential to cool the BE14 card chips and you pretty much ruined its thermal conductivity. You need to replace the whole bottom plate or buy a new case entirely.

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This is wrong, you shouldn’t put heatsink on top of the BE14 unless you are running the whole setup caseless.

The BE14 chips need to be fitted with thick thermal pads that will come directly into contact with the bottom of the case (assuming it’s intact).

In fact I don’t think the heatsinks in your picture are enough to cool the BE14 chips while running caseless, you would need them in tandem with active cooling.

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Good morning @Mathieulh, thanks for your advice, because what I have done again has been to remove the cardboard and the tape, and that my refrigeration keeps them cold, don’t worry, if the bed14000 burns, it will be my responsibility.

Thanks for your wise advice,

Regards

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Speaking of thermal pads for the BE14 chips, is there any official info on pad thickness? I tried to measure the gap between the chips and the bottom plate of the chassis with a feeler gauge, but other components were getting in the way.

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Here he talks about the thermal pads used in the BE14 WiFi 7 module:

Thermal pad comparison to know which one to buy:

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