I am currently working with him on the antennas
Can you say something about the power consumption?
I’m sorry but I haven’t taken what the power consumption is.
What’s the thing that you put on the SFP cages? 
Its a heatsink you can get off AliExpress
I guess similar to mine
I know the forum isn’t good at showing what I replied too, seeing that you and @SpectreDev both answered the same in regard to the original post. But I was replying to the post that had this image https://forum.banana-pi.org/uploads/default/original/2X/e/e18c24373fce518db72c0791116425147913e79d.jpeg in it.
Ah,sorry…looks like an external rtc due to the cell battery
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Ah, I think that’s the RTC battery
Yes, that is a battery “case” for the RTC clock which is already part of the board. Got this from amazon in a 10x package where about 60% worked…
The one I got is this https://www.amazon.co.uk/gp/product/B09WVL8XNB, but I want to belive that there are better options.
This is especially dumb, you are literally drilling thermal mass out of the case, the case is a heatsink, the less materials it has, the less efficiently it’ll cool the board. Drilling the bottom part is even worse as this part comes into direct contact of the BE14000 ICs thermal pads.
This is some really bad work, should’ve just replace the top with a mesh at most
Good morning @Mathieulh, thanks for the notice, we will cover the bottom where the be14.000 is located to protect it and prevent direct air from hitting it.
Also, on the top part, vents have been made so that the air can escape, as long as it looks aesthetically I don’t care, what I didn’t want was to burn any component of the board or the be14000 module, my box really burned.
I don’t know if this will be enough, but at least it won’t be the toaster I had before, it burned the box.
Good afternoon @Mathieulh, I have finally put this covering the air that entered the be14000 module, it covers it exactly, I hope it is enough, for the rest it remains as follows.
Thanks for the information
whats the point of putting the holes and then covering it with tape
You should know that they built this case as part of a heat-sinking system. Thermal transfer happens on the contact part (the thermal pad between the wireless module and the shield). If you drill holes in the bottom plate, then it would only reduce the area that could directly contact the shell - which reduces the efficiency of heat dissipation. What I suggest would just remove the contact part of the shield, and directly apply an active/passive heat sink on it.
For everyone who hasn’t gone this far, I suggest purchasing some tiny heatsinks from Amazon (Like those: https://www.amazon.ca/Awxlumv-Heatsink-25-x25-x10/dp/B08CMK8BMT) and directly pasting under the bottom, that will increase the area of heat transfer if you are afraid of getting overheat.
Good afternoon, I bought these and had to remove them from the box, they did not fit. I do not know what size the ones you have included are, but they should be very small.
Here are the measurements 13x12x3mm
Here is another photo
I think mine were smaller and when you close the box they don’t fit.
This is the heatsink that you buy on Aliexpress