Looking at the picture, it appears to me to that installing passive heat sinks on the larger chips will prevent insertion of mPCI cards in connectors CN11 and CN13.
As a standard practice I install passive heat sinks on the main chips of SBCs to help heat dissipation.
I would appreciate clarification from those who have this board. I don’t want to order the board from AliExpress only to return it back because the heat sinks will not allow me to install mPCI modem or WiFi card.
If the height of the components or shielding cover at the bottom of the module is within 1.5mm, or if it is higher than 1.5mm but the distance from the gold fingers is within 10mm, then there is no problem.
Have you picture where heatsink is mounted? I’ve noticed that there is not much space between be14 and R4lite for a heatsink. But most chips are there which may cause the heat.
Yes, the BPI-BE14 card can be installed.But other devices can be installed only if the components beneath it do not come into contact with the heat sink.However, this board does not have the M.2 KeyM interface, so it is impossible to install an NVME SSD.
I suppose it should work with loading the Linux **nvme** kernel module. I plan to use the OpenWRT image (currently in the snapshot branch) for this board.