[BPI-R3] information

What exactly do you mean by “thingies”? Pigtail cables? They should come with the modem, as they need to match the modem’s connectors (MHF.4, u.FL, …)

Sadly there is only a mPCIe slot, so any modem faster than ~ 200MBit/s (speed of USB 2.0 + overhead) is useless anyway as mPCIe does not provide USB 3.0 connectivity needed for faster modems. I’m using Sierra Wireless EM7455 in an NGFF-to-mPCIe adapter and it works well, but for the above reasons speed is capped at around 200MBit/s even though the modem is capable of 300MBit/s with carrier aggregation.

If you want fast WWAN connectivity, you will need an additional external USB 3 -> M.2/NGFF adapter, use that to host a modern 4G/5G modem and connect it to the USB 3 port of the R3.

yes, that is what I meant with the thingies. so it comes with the card. ok.

Any advice for a card that doesn’t need adapter and fits directly onto the provided socket?

Quectel EC25-G would be the natural choice for a simple Cat.4 (150 MBit/s max downstream) modem directly fitted to mPCIe slot.

The connectors on this modem are U.FL, so make sure to get 3x U.FL to SMA pigtails (or directly antennas) with it.

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what about this one?

seems better. I know that it wont go past 200 or so but the chip seems newer and better.

Yes, that should work just as well. Make sure to buy the right version for your region as for the EP06 there is no -G (global) version.

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last question I guess, is heatsink for the banana. what would be a good choice ( without fan and with fan )

Loaded banana with two 2.5gbe gbics, one 2tb nvme drive and one EC25-e 4g module. Also the first attempt at a case for the thing. It still needs a lot of tweaking until it fits ok.

photo_2022-10-25_13-37-25 photo_2022-10-25_13-37-33 photo_2022-10-25_13-37-43

It helped alot. it’s what I am using on my attempt to make a case. Thanks! If it ends up acceptable I will release it for everyone.

Having said that, I think this thing needs a metal case that can act as a heatsink for the nvme and cpu.

nice, it this already printed?

if you do not make a metal case, you have walls ~3mm thick which may prevent sfp and rj45 to be pluggin in. in my old case i made a smaller thickness there for ~2mm around these jacks

note that the holes for sd/sim and the bootswitches must be larger than the slot itself to get on it with fingers

yes, I printed it yesterday. right now I’m printing just the front part to make adjustments.

But if I make something usable it will be only temporary. This thing really needs a metal case.

Screenshot%20from%202022-10-25%2015-04-51

currently looks like this: Screenshot%20from%202022-10-25%2015-09-58

It’s basically a remix of a case I found on thingyverse.

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Hi everyone.

I’m a bit outdated on R3 news. Is the board already released an available on the market?

yes, I bought mine from an amazon seller in Europe

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I suggest to wait for next hw-revision when reset-bug is fixed.

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it’s not fixed in 1.3?

what is that reset bug about?

Can you please share the STL file?

Afaik there is only v1.1

Reset-bug: [BPI-R3] information

Should be fixed in upcoming 1.2

@azsenca it is not yet a complete case

Is there a heatsink matchin the 43mm holes on the board? Or are these holes for anything else?

Hi,

R3 seems really nice but I need two radio on 5Ghz, can someone confirm me that I can use this module : https://www.asiarf.com/shop/wifi-wlan/wifi-m-2-card/wifi6-2t2r-dual-bands-dual-concurrents-dbdc-m-2-card-bm-key-1800-ieee802-11ax-2-4g-5ghz-mt7915-aw7915-bmd/ on the M2 slot or not ?

Thanks

I’m curious what is expected performance of BPI-R3 vs my current Turris Omnia.

This is not super scientific method, but does give a rough estimate of what to expect. Could some one run Geekbench 5 for ARM64 and share results? For ex. Turris Omnia gets ~100 SC, ~180 MC (on arm32).

wget https://cdn.geekbench.com/Geekbench-5.4.4-LinuxARMPreview.tar.gz
tar zxf Geekbench-5.4.4-LinuxARMPreview.tar.gz
cd Geekbench-5.4.4-LinuxARMPreview/
./geekbench_aarch64