Hi frank, first I have to say, I did not made a professional measurement!
After I had access to the board, I took a ruler and looked at the height ratio of the different chips. The chips with green point looked similar.
I ordered 1x 0.5 mm pad and 1x 1.0 mm pad (I know it’s expensive). → First try was 0.5 mm (orange) and the others 1.0 mm (green). But there was a visible inequality. 1.0 mm was too less. → So, I took the 0.5 mm pads and do them additionally on the 1.0 mm pads. → At the end it was 0.5 mm (orange) and 1.5 mm (green)
The problem is, that the main-target is to cool the processor in the middle. But there is no visible proof that the pad has 100% contact with this chip. This is why I take the “soft” variant of this EC360 pads.
I think it was a good choice. My basic tests show a quick temperature change after i removed the top cover (I did not jet made a hole for the fan in the top cover). I now, this is not a direct proof. But a good start .
So, if you have enough 1.0 mm you will only need an additional 0.5 mm .
!!! I forgot an important detail:
I take away ca.1 mm of the screw sleeve on the backside of the heat sink.
I filed this away with a rasp. It was just a prevention to make sure that there would be no space between the heat sink and thermal pad. But this also means you have to be very careful during tighten the screws.