I am interested in the copper heatsink without fan. Any idea where i can buy one like those?
The one from sinovoip will be replaced and i’ll add two noctua fan’s in the case (one for SoC and one for SFP+)
I am wondering if anyone tried something like https://de.aliexpress.com/item/1005006281231245.html ? Will this stay on the CPU if i use thermal tape? Or is it possible to somehow get those push pins, create the holes and create a “DIY” heatsink?
I am not big fan of thermal tapes, and I used them only when ther is not any other option. I used them only on SATA multipliers where was not any heatsing on the chip. It looks ok, but the heatsink is very small.
As I prefer fan-less sollution, i try the heatsing with 30mm of height and used thermal grease with about 15W/mK on cpu and the ram chips.
I’ve just noticed that it 1mm distance difference between holes … after my cooler from R3 finally arrived. Ive changed R3 cooler a bit and need some tools to finish my copper thermal pad under it. Im going to use thermal paste instead of thermal silicon pads or tapes
the final result will looks like … I drilled new holes and cut new threads for the bolts.
My final result … Room temperature is 25°C … and R4 in closed metal case. Heatsink from R3 with copper pads that are glued to heatsink with thermal glue and thermal past is used
I bought it from a local flea market. The hole distance was not right. Had to do some non trivial modding to fit the mounting holes. I would have avoided had I known mm or two would make such a huge difference.
Fin height is crucial. I opted for 10-15mm b’cos I want to fit a 15mm fan in a couple years time. Otherwise, I would definitely go for taller fins.
Hi there,
I am currently working on modifications for the Banana Pi R4 model, specifically to integrate a PoE module,Display and make some other additional adjustments to the outer case. To effectively implement these changes, I require the original design drawing of the outer case.
I would appreciate it if you could provide the necessary design files or any relevant technical documentation that would assist in these modifications.