Due to the poor heat dissipation of the original shell, we have redesigned a brand new shell.
The old shell relies on a top mounted fan and a metal casing for heat dissipation; The new casing has added heat sinks at the bottom, and the top mounted fan has become the bottom.
New shell
Old shell
Next, compare the differences between the two casings under IDLE and pressurized conditions.
R3 mini idle temperature for one hour
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Old shell:
1.CPU: 56 β
2.Top cover, right cover, Ethernet side cover, USB side cover, left cover, bottom cover:
43.1β , 48.5β, 45.9β ,51.2β, 48.0β, 50.2β
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New shell:
1.CPU: 47.7β
2.Top cover, right cover, Ethernet side cover, USB side cover, left cover, bottom cover:
37.1β , 40.0β , 38.8β , 43.5β , 37.4β , 41.5β
R3 mini pressurization temperature for one hour
Use βstress - vm 10- vm bytes 180M - c 4- io 10β for pressure testing
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Old shell:
1.CPU: 66.5 β
2.Top cover, right cover, Ethernet side cover, USB side cover, left cover, bottom cover:
47.5β , 53.5β , 53.8β , 54.9β , 52.4β , 56.2β
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New shell:
1.CPU: 49.2β
2.Top cover, right cover, Ethernet side cover, USB side cover, left cover, bottom cover:
39.9β , 41.9β , 40.5β , 42β , 40.6β , 40.8β
There is a significant decrease in both CPU temperature and shell temperature.